Method of producing sintered rare earth magnetic alloy wafer

Details Method of producing sintered rare earth magnetic alloy wafer Method of producing sintered rare earth magnetic alloy wafer

2006-02-07

2006-02-07

Sheehan, John P. (Department: 1742)

Metal treatment

Process of modifying or maintaining internal physical...

Magnetic materials

C148S102000, C419S026000, C125S016010, C125S016020, C125S021000, C029S557000

Reexamination Certificate

active

06994756

ABSTRACT:
A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.

REFERENCES:
patent: 6408840 (2002-06-01), Ishida
patent: 6443143 (2002-09-01), Ishida et al.
patent: 2002/0115390 (2002-08-01), Kondo et al.
patent: 2004/0231134 (2004-11-01), Kondo et al.
patent: 2001-300842 (2000-04-01), None
Metals Handbook Ninth Edition vol. 16, 1989, pp. 121-123.
Metals Handbook Edition vol. 16, 1989, pp. 453-456.

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