Method of producing semiconductor wafer through gettering using

Details Method of producing semiconductor wafer through gettering using Method of producing semiconductor wafer through gettering using

1989-07-10

1991-09-24

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437939, 437946, 148DIG60, 148DIG24, H01L 2130

Patent

active

050513753

ABSTRACT:
Disclosed is a method of producing a semiconductor wafer through gettering by means of sand blasting in a semiconductor wafer fabrication process. The method includes blasting abrasives each having a configuration at least similar to a sphere against a back surface of the semiconductor wafer, causing shear stress having a maximum point in the interior of the wafer to be generated, whereby damage is produced mainly in the interior of the wafer.

REFERENCES:
patent: 4525239 (1985-06-01), Wang
patent: 4820650 (1989-04-01), Nagae et al.

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