Fishing – trapping – and vermin destroying
Patent
1993-09-03
1995-03-07
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437 62, 437974, 148DIG12, 148DIG150, H01L 2176
Patent
active
053957881
ABSTRACT:
The present invention provides a method of making a semiconductor substrate having an SOI structure by temporarily bonding together two wafers having different thermal expansion coefficients to allow thinning of at least one of the wafers by chemical and/or mechanical treatment(s) to reduce the risk of strain, separation, cracks to the wafers followed by one or more heat treating steps to fully bond the wafers together. The method can produce semiconductor substrate having an SOI structure which can provide a silicon layer thin enough to allow various integrated circuits, or TFL-LCD or the like to be formed.
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Abe Takao
Nakazato Yasuaki
Uchiyama Atsuo
Dang Trung
Hearn Brian E.
Shin Etsu Handotai Co., Ltd.
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