Method of producing semiconductor pressure sensor

Details Method of producing semiconductor pressure sensor Method of producing semiconductor pressure sensor

1993-01-22

1995-03-07

Chilcot, Jr., Richard E.

Measuring and testing

Fluid pressure gauge

Mounting and connection

257676, 257696, G01L 700

Patent

active

053947517

ABSTRACT:
A semiconductor pressure sensor has a semiconductor pressure sensing element sensitive to pressure and a hollow package accommodating the semiconductor pressure sensing element. The semiconductor pressure sensor also has a first lead frame portion having a displaced die pad to which the semiconductor pressure sensor is die bonded and a plurality of suspension leads through which the die pad is suspended at its opposing sides. The semiconductor pressure sensor also has a second lead frame portion having a plurality of suspension leads which provide electrical connections between the semiconductor pressure sensing element and external devices. The package includes a resin base accommodating the semiconductor pressure sensing element fixed to the die pad and a resin cap bonded to the resin base with the first and second lead frame portions sandwiched therebetween with the die pad suspended in the resin base and the plurality of leads extending outwardly from the package.

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