Method of producing semiconductor package having solder balls

Details Method of producing semiconductor package having solder balls Method of producing semiconductor package having solder balls

1996-05-08

1999-01-05

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438125, H01L 2144

Patent

active

058562125

ABSTRACT:
A semiconductor package with solder balls and a method for producing the package are disclosed. The package has no outer lead but is provided with the solder balls formed on the mold resin body, thus to allow a plurality of packages to be easily vertically layered when enlarging the memory capacity. The package producing method forms the solder balls through screen printing or dotting, or electroplating and vacuum depositing of solder paste, thus to need no typical forming step and to achieve the thinness of the package. A plurality of holes are provided in at least one of the top section and the bottom section of the mold resin body such that the holes communicate with the inner leads respectively. The solder balls are formed on the holes under the condition that a plurality of conductors are charged in the holes. The solder balls are electrically connected to the inner leads through the conductors.

REFERENCES:
patent: 5025307 (1991-06-01), Ueda et al.
patent: 5403776 (1995-04-01), Tsuji et al.
patent: 5461197 (1995-10-01), Hiruta et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5616962 (1997-04-01), Ishikawa et al.
patent: 5648683 (1997-07-01), Takahashi

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