Method of producing semiconductor package, apparatus for...

Details Method of producing semiconductor package, apparatus for... Method of producing semiconductor package, apparatus for...

2007-05-08

2007-05-08

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S118000, C438S106000, C257SE21499, C257SE23001

Reexamination Certificate

active

10942821

ABSTRACT:
A method of producing a semiconductor package enabling a sheet-like adhesive film to be used as it is and thereby reducing loss and enabling mounting without the piece of adhesive film sticking out from the semiconductor chip, comprising forming cutting-off notches in an adhesive film provided on a support film from the adhesive film side down to the surface of the support film or a depth D in the middle and cutting the adhesive film to pieces of predetermined size, then stretching the support film to separate the cut individual piece of the adhesive film, attaching semiconductor chip to the cut individual piece of the adhesive film, and mounting the semiconductor chip on a substrate by the piece of adhesive film, and an apparatus for producing a semiconductor package and adhesive film for use with that method.

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patent: 6451671 (2002-09-01), Yamada
patent: 6514795 (2003-02-01), Jiang et al.
patent: 2003/0034120 (2003-02-01), Yanagisawa et al.
patent: 2003/0190795 (2003-10-01), Kawakami
patent: 56-120136 (1981-12-01), None
patent: 60-224236 (1986-03-01), None
patent: 07-045557 (1995-06-01), None
patent: WO 03/077310 (2003-09-01), None
European Search Report.

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