Method of producing semiconductor memory packages

Details Method of producing semiconductor memory packages Method of producing semiconductor memory packages

1989-08-10

1992-03-17

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

179DIG8, 206328, 206523, 206591, 357 72, 361395, H01R 4300

Patent

active

050956264

ABSTRACT:
In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging.
To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices wherein the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.

REFERENCES:
patent: 3454154 (1969-07-01), Peters et al.
patent: 3909504 (1975-09-01), Browne
patent: 4496406 (1985-01-01), Dedow
patent: 4529087 (1985-07-01), Neal et al.
patent: 4648508 (1987-03-01), Neal et al.
patent: 4695926 (1987-09-01), McDermott
patent: 4760916 (1988-08-01), Kaneko et al.
Computer Obtained Abstract Titled: The Developement of Mini Plastics IC Packaging for Dip Soldering, a paper from 34th Electronic Components Conf. held in New Orleans, 14-16 May 1984, pp. 383-387.

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