Method of producing semiconductor memory

Details Method of producing semiconductor memory Method of producing semiconductor memory

1992-07-20

1994-03-22

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

206328, 206523, 206591, 361736, H01R 4300

Patent

active

052952975

ABSTRACT:
In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging.
To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.

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