Method of producing semiconductor devices including a step of di

Details Method of producing semiconductor devices including a step of di Method of producing semiconductor devices including a step of di

1996-11-13

1999-07-27

Dutton, Brian

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

438118, 428354, H01L 21301, H01L 2146, H01L 2178

Patent

active

059306548

ABSTRACT:
A method of producing semiconductor devices includes the steps of disposing an adhesive tape over a wafer such that an adhesive surface of said tape faces a top surface of said wafer, disposing a flexible urging member over the tape in a state that the flexible urging member causes a deformation by a gravity such that the flexible urging member causes a bulging in a downward direction toward the adhesive tape, moving the flexible urging member relatively to the adhesive tape in engagement with the adhesive tape such that the adhesive tape is deformed in conformity with the flexible urging member and the adhesive tape causes a bulging in a downward direction toward the wafer, and contacting the deformed adhesive tape on the top surface of the wafer.

REFERENCES:
patent: 3562058 (1971-02-01), Boyd

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