Method of producing semiconductor device with a buried layer

Fishing – trapping – and vermin destroying

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437 31, 437 97, 437 95, 437931, 117 96, 148 7, 148 18, H01L 21266

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056960042

ABSTRACT:
A method of producing a semiconductor device having a high concentration N-type buried layer on a P-type silicon substrate, the buried layer being covered with a P-type silicon epitaxial layer. The method comprises forming a P-type high concentration layer at a surface portion of the silicon substrate in a region in which no N-type buried layer is to be formed, thereby preventing an inversion layer from being formed at the boundary between the silicon substrate and the epitaxial layer.

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