Method of producing semiconductor device

Details Method of producing semiconductor device Method of producing semiconductor device

2007-08-08

2010-11-02

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Grooved and refilled with deposited dielectric material

C438S928000

Reexamination Certificate

active

07825004

ABSTRACT:
A method of producing a semiconductor device according to the present invention comprises steps of:(A) forming trenches (13) on the front surface (FS) of a semiconductor substrate (11) on the back surface (BS) of which a nitride film (12b) is formed;(B) depositing an insulating film (15) to bury the trenches (13);(C) removing the nitride film (12b) on the back surface (BS) of the semiconductor substrate (11) after the step (B); and(D) annealing before the insulating film (15) is etched after the step (C).

REFERENCES:
patent: 5562770 (1996-10-01), Chen et al.
patent: 5985743 (1999-11-01), Gardner
patent: 6297128 (2001-10-01), Kim et al.
patent: 6734082 (2004-05-01), Zheng et al.
patent: 6844237 (2005-01-01), Jin et al.
patent: 7238586 (2007-07-01), Hsu et al.
patent: 2005/0253199 (2005-11-01), Nagaoka
patent: 63-015439 (1988-01-01), None
patent: 08-153862 (1996-06-01), None
patent: 2004-111828 (2004-04-01), None
patent: 2004-158711 (2004-06-01), None
patent: 2005-286091 (2005-10-01), None
patent: 2005-322859 (2005-11-01), None
patent: 2005-340734 (2005-12-01), None
patent: 2005-340734 (2005-12-01), None
patent: 2006-120703 (2006-05-01), None

Affiliated with

Also associated with

Rating

Method of producing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4192861