Method of producing semiconductor device

Details Method of producing semiconductor device Method of producing semiconductor device

1989-08-11

1992-05-26

Kunemund, Robert

Fishing, trapping, and vermin destroying

437183, 437198, 437220, H01L 2330

Patent

active

051167832

ABSTRACT:
A method of producing a semiconductor device includes bonding a semiconductor chip to a die pad of a lead frame by means of a silicone resin, to bonding a copper wire and an aluminum electrode of the semiconductor chip in such a manner that intermetallic compound mainly consisting of CuAl.sub.2 is formed in the bonding region. This method suppresses the deterioration of the copper-aluminum alloy layer and these semiconductor devices have a high reliability at a high temperature, as well as uniform quality in the production.

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patent: 3790866 (1974-02-01), Meyer et al.
patent: 4139726 (1979-02-01), Penrod et al.
patent: 4821148 (1989-04-01), Kobayashi et al.
patent: 4821944 (1989-04-01), Tsumura
patent: 4842662 (1989-06-01), Jacobi
patent: 4891333 (1990-01-01), Baba et al.
Chemical Abstract 108(16):141335y.
Chemical Abstract 108(10):85976u.
Tsumura, "Fundamental Study of the Copper Wire Ball Bonding Technology", May 25-27, 1988.

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