Method of producing semiconductor components and strip for carry

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29590, 29591, 29576S, B01J 1700

Patent

active

040416020

ABSTRACT:
A method is disclosed for producing semiconductor components by contacting the electrodes of disk-shaped semiconductor chips with at least one pn-junction by means of a comb with contact legs. The method includes bending a strip coated with solder on at least one side into a number of identical sections each having a wing-like profile viewed normal to the length of the strip, laying the side of the winged strip opposite the wings on the top main surfaces of the semiconductor chips and pre-attaching it to them. The method further includes aligning a cooling-fin comb and/or leg comb in a soldering jig, introducing the winged strip with the pre-attached semiconductor chips, soldering the resultant comb system which is held together by pressure on the winged strip, cutting apart the conducting links between the semiconductor electrodes formed by the winged strip, lacquering, baking and encapsulating in plastic the comb system except for the ends of the electrode leads formed by the contact legs.

REFERENCES:
patent: 3497947 (1970-03-01), Ardezzone
patent: 3553828 (1971-01-01), Starger
patent: 3698073 (1972-10-01), Helda

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of producing semiconductor components and strip for carry does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing semiconductor components and strip for carry, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing semiconductor components and strip for carry will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-351777

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.