Method of producing resin-sealed electronic device

Details Method of producing resin-sealed electronic device Method of producing resin-sealed electronic device

1997-05-27

1999-08-31

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438118, 438126, H01L 2144, H01L 2148, H01L 2150

Patent

active

059465549

ABSTRACT:
In a method of producing a resin-sealed electronic device, a solder resist layer including a silicone family surfactant is coated on a printed circuit board. Thereafter, an electronic component is mounted on the solder resist layer through adhesives, and is sealed by sealing resin. The content of the silicone family surfactant in the solder resist layer is less than 3 wt %, more preferably, is in a range of 0.2 wt % to 1 wt %. Accordingly, adhering reliability of the sealing resin relative to the solder resist can be improved, thereby resulting in high reliability of the resin-sealed electronic device for a long time.

REFERENCES:
patent: 5139969 (1992-08-01), Mori
patent: 5173765 (1992-12-01), Nakayashi et al.
patent: 5424254 (1995-06-01), Damiot
patent: 5471027 (1995-11-01), Call et al.
patent: 5514912 (1996-05-01), Ogashiwa
patent: 5665651 (1997-09-01), Asada et al.
patent: 5731231 (1998-03-01), Miyajima

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