Method of producing printed circuit boards

Details Method of producing printed circuit boards Method of producing printed circuit boards

1987-05-06

1988-10-25

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

179 685, 427 96, H05K 310

Patent

active

047793392

ABSTRACT:
A method of producing printed circuit boards comprises the steps of applying a first solder resist on the conductor circuit pattern so as to surround lands to be soldered in the pattern and then applying a second solder resist to the whole surface of the pattern so as to leave portions having a size larger than the size of the land and smaller than the outer diameter of the first solder resist.

REFERENCES:
patent: 3250848 (1966-05-01), Beelitz et al.
patent: 3567844 (1971-03-01), Kremar
patent: 3610811 (1971-10-01), O'Keefe
patent: 3619899 (1977-11-01), Takeda et al.
patent: 4301189 (1981-11-01), Arai et al.
patent: 4413309 (1983-11-01), Takahashi et al.
patent: 4638116 (1987-01-01), Gumb

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