Method of producing printed circuit boards

Details Method of producing printed circuit boards Method of producing printed circuit boards

1982-05-20

1984-05-29

Lawrence, Evan K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427203, 427205, 427304, 427305, 427306, 427427, B05D 306, B05D 310, B05D 106

Patent

active

044515057

ABSTRACT:
The manufacture of printed circuit boards on a substrate material with a thermosetting adhesive layer. The adhesive layer is roughened by spraying with a suspension of hard particles. Thereafter the surface is provided with a layer of uniformly distributed particles of a light-sensitive, semiconductive metal oxide by spraying with a suspension of said oxide particles, which oxide after exposure to light is capable of releasing copper and/or a metal which is nobler than copper from a solution of the relevant metal salt the layer is exposed to light and is sprayed prior to and/or after the exposure with a solution of the afore-said metal salt, so that metal nuclei are formed in the exposed areas. Both operations are effected by spraying and that in such a way that the semiconductive oxide and the metal salt, respectively are substantially dry when they reach the surface. After exposure, the nuclei are intensified by means of an electroless copper plating bath.

REFERENCES:
patent: 2690403 (1954-09-01), Gutzeit et al.
patent: 2956901 (1960-10-01), Carlson et al.

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