Method of producing positive slope step changes on vacuum deposi

Details Method of producing positive slope step changes on vacuum deposi Method of producing positive slope step changes on vacuum deposi

1982-03-26

1983-09-20

Morgenstern, Norman

Coating processes

Electrical product produced

Superconductor

427 99, 427250, 4272551, B05D 512

Patent

active

044056583

ABSTRACT:
During the process of vacuum deposition, metals and materials are evaporated at a point source so as to create a vapor which is dispersed isotropically. Layers of the evaporating material are deposited as built-up layers which have sharp vertical edges or steps at the areas defined by the photoresist stencil. When the line of sight of the depositing material is from an oblique angle, the layer being deposited can have a negative slope which appears as an undercut edge. The present invention employs a lift-off overhang photoresist stencil in conjunction with a relatively high pressure of inert gas in the vacuum chamber so as to promote collision of the evaporated atoms and molecules with the inert gas. The colliding atoms and molecules of the evaporating material no longer appear to be originating from a point source but appear to originate from an extended area in the end of the vacuum chamber and deposit under the overhang photoresist stencil so as to provide symmetrical positive slope step changes at the edges of the material being deposited.

REFERENCES:
patent: 4129167 (1978-12-01), Sigsbee
patent: 4224361 (1980-09-01), Romankiw
patent: 4256816 (1981-03-01), Dunkelberger
patent: 4353935 (1982-10-01), Symersky
Colligon, Vacuum, 11, 272 (1961).
Powell et al., Vapor Deposition, John Wiley & Sons, Inc. N.Y., .COPYRGT.1966, pp. 233-236.
Vossen et al., Thin Film Processes, Academic Press N.Y., .COPYRGT.1978 p. 12.
Berry et al., Thin Film Technology R. E. Krieges Publishing Co., N.Y., .COPYRGT.1968, pp. 8-9.

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