Method of producing piezoelectric component and...

Details Method of producing piezoelectric component and... Method of producing piezoelectric component and...

2007-08-28

2007-08-28

Mayes, Melvin (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S300000, C156S308200, C310S348000

Reexamination Certificate

active

10728540

ABSTRACT:
A surface acoustic wave element is mounted onto a mounting substrate having a terminal electrode via a bump by flip chip bonding. The surface acoustic wave element is covered with a resin film. The periphery of the surface acoustic wave element mounted on the mounting substrate is covered with a portion of the resin film so that the surface acoustic wave element is sealed. The resin film is hardened. Thus, a surface acoustic wave device is provided.

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