Method of producing parts/substrate assemblies

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29832, B23P 1100, H05K 330

Patent

active

057459720

ABSTRACT:
A system for producing parts/substrate assemblies each of which includes a substrate such as a ceramic substrate and a plurality of parts such as LSIs mounted on the substrate. After the LSIs for one lot of the production have been checked for excess or deficiency, etc. by a collating device, they are formed with solder bumps and then inspected. The LSIs are automatically arranged on empty work pallets as parts kits by a kit setting apparatus, and the work pallets on each of which the corresponding LSIs have been arranged as the parts kit are moved into a stocker. A host computer gives a command for mounting the LSIs on the ceramic substrate on which they can be mounted, on the basis of information indicating the stocked pallet and information indicating the progress of the ceramic substrate. An LSI mounting apparatus reads the serial No. of the introduced ceramic substrate, and requests the stocker to deliver the work pallet on which the associated LSIs have been arranged as the parts kit.

REFERENCES:
patent: 4377890 (1983-03-01), Miller
patent: 4473935 (1984-10-01), Tatsuura et al.
patent: 4703558 (1987-11-01), Makinen
patent: 4719694 (1988-01-01), Herberich et al.
patent: 4783904 (1988-11-01), Kimura
patent: 4821197 (1989-04-01), Kenik et al.
patent: 4872257 (1989-10-01), Wakamori et al.
patent: 4884330 (1989-12-01), Sticht
patent: 5024570 (1991-06-01), Kiriseko et al.
patent: 5231585 (1993-07-01), Kobayashi et al.
patent: 5237510 (1993-08-01), Kakizawa et al.
patent: 5283943 (1994-02-01), Aguayo et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of producing parts/substrate assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing parts/substrate assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing parts/substrate assemblies will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-44512

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.