Method of producing multiple semiconductor devices

Details Method of producing multiple semiconductor devices Method of producing multiple semiconductor devices

2008-09-19

2011-11-08

Dang, Phuc (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S106000, C438S123000, C257SE21499, C257SE23116

Reexamination Certificate

active

08053280

ABSTRACT:
A method for producing multiple semiconductor devices. An electrically conductive layer is applied onto a semiconductor wafer. The semiconductor wafer is structured to produce multiple semiconductor chips. The electrically conductive layer is structured to produce multiple semiconductor devices.

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patent: 2006079865 (2006-08-01), None
patent: 2006090199 (2006-08-01), None

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