Method of producing multilayer printed wiring board and...

Details Method of producing multilayer printed wiring board and... Method of producing multilayer printed wiring board and...

2011-02-15

2011-02-15

Davis, Daborah Chacko (Department: 1795)

Metal working

Method of mechanical manufacture

Electrical device making

C430S311000, C156S272200

Reexamination Certificate

active

07886428

ABSTRACT:
A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist, characterized in that the photosensitive dry film has a nitrogen-containing heterocyclic compound layer on its either surface.A photosensitive dry film capable of improving the compatibility between thin-film conductor layer and photosensitive dry film to strengthen the adhesion force and to prevent the occurrence of floating or the like in the photosensitive dry film as well as a method of producing a multilayer printed wiring board using such a dry film.

REFERENCES:
patent: 5015555 (1991-05-01), Lazaar
patent: 9-130050 (1997-05-01), None
patent: 2003-101220 (2003-04-01), None
patent: 2004-317874 (2004-11-01), None

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