Method of producing multilayer interconnection board

Details Method of producing multilayer interconnection board Method of producing multilayer interconnection board

2005-01-11

2008-10-21

Talbot, Brian K (Department: 1792)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S097100, C427S097200, C427S271000, C427S272000, C427S282000, C427S355000, C427S369000

Reexamination Certificate

active

07438945

ABSTRACT:
A method of producing a multilayer interconnection board is disclosed that includes the steps of processing a resin member on an interconnection layer by imprinting press, and removing residue of the resin member at the bottom of a via hole after forming the via hole. In the method of producing a multilayer interconnection board, a thermal setting resin, which has a setting temperature higher than that of the resin member, is applied on a via-connecting portion of the interconnection layer, the resin member is formed on the interconnection layer, an interconnection groove and a via hole are formed by imprinting press on the resin member by using a tool, and an un-cured portion of the high temperature setting resin is dissolved and removed by using a resin solvent. Thereby, residue of the resin member on the thermal setting resin is removed.

REFERENCES:
patent: 6869557 (2005-03-01), Wago et al.
patent: 2003/0112576 (2003-06-01), Brewer et al.
patent: 10-117058 (1998-05-01), None

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