Method of producing multilayer circuit boards

Details Method of producing multilayer circuit boards Method of producing multilayer circuit boards

1995-11-30

1997-10-28

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

216 20, 216 43, B44C 122, C23F 100

Patent

active

056814852

ABSTRACT:
A method of producing multilayer circuit boardschar comprising repeating a procedure comprising the steps of (1) laminating a photosensitive film composition shaped in a film form onto an insulating material carrying a conductor pattern formed thereon, (2) exposing the laminated photosensitive film composition to light through a negative type photomask, (3) dissolving the domains not irradiated in the above exposure step, (4) heat-curing the domains not dissolved in step (3), (5) forming a copper plating layer on the surface of the photosensitive film composition heat-cured in step (4) by electroless copper plating with or without further electroplating of copper, and (6) forming, on the plated copper layer formed in step (5), a photosensitive etch resist layer and subjecting said layer to light exposure through a photomask having a circuit pattern drawn thereon, developing and etching to thereby form a conductor pattern, said photosensitive film composition for lamination containing at least 50% by weight of a bisphenol-epichlorohydrin type resin containing photosensitive functional groups and heat-curable functional groups.

REFERENCES:
patent: 3832176 (1974-08-01), Verstraete et al.
patent: 4075757 (1978-02-01), Malm et al.

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