Method of producing MIS structure

Details Method of producing MIS structure Method of producing MIS structure

1973-09-26

1976-08-03

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29571, 148187, 156 11, 156 13, 357 22, 357 23, 427 88, H01L 750

Patent

active

039727564

ABSTRACT:
A method of producing an MIS structure having self-alignment construction, wherein an insulating film is formed on the surface of a semiconductor substrate, a semiconductor layer is formed on a selected area of the insulating film, parts of the insulating film are etched using the semiconductor layer as a mask, and the surface of the semiconductor layer is etched in such manner that the underlying insulating film may not be etched, whereby the marginal portion of the semiconductor layer which otherwise projects laterally beyond the underlying insulating film is caused to recede.

REFERENCES:
patent: 3474310 (1969-10-01), Ono et al.
patent: 3475234 (1969-10-01), Kerwin et al.
patent: 3646665 (1972-03-01), Kim
patent: 3700508 (1972-10-01), Keen

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