Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-01-11
2005-01-11
Chang, Richard Kiltae (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S425000, C174S250000, C361S748000, C083S051000, C083S861000, C083S929100, C083S929200
Reexamination Certificate
active
06839962
ABSTRACT:
A micromechanical structure is described which is disposed on a base body and requires protection from environmental influences by a covering body. Furthermore, electrical contacts are necessary for establishing contacts for the micromechanical structure. By skillfully carrying out a sawing-into operation and a sawing-through operation, it is possible to expose the electrical contact.
REFERENCES:
patent: 2941560 (1960-06-01), McCaffery
patent: 3466743 (1969-09-01), Puy
patent: 3614968 (1971-10-01), Hirz
patent: 3656378 (1972-04-01), Davis
patent: 3731243 (1973-05-01), Davis
patent: 3999290 (1976-12-01), Wood
patent: 4338149 (1982-07-01), Quaschner
patent: 4532839 (1985-08-01), Easton
patent: 4567545 (1986-01-01), Mettler, Jr.
patent: 4621552 (1986-11-01), Lopez
patent: 4846032 (1989-07-01), Jampathom et al.
patent: 4931134 (1990-06-01), Hatkevitz et al.
patent: 5004639 (1991-04-01), Desai
patent: 5061988 (1991-10-01), Rector
patent: 5253415 (1993-10-01), Dennis
patent: 5435876 (1995-07-01), Alfaro et al.
patent: 5499444 (1996-03-01), Doane et al.
patent: 5622588 (1997-04-01), Weber
patent: 5638597 (1997-06-01), Cutting et al.
patent: 5668033 (1997-09-01), Ohara et al.
patent: 5729437 (1998-03-01), Hashimoto
patent: 5773764 (1998-06-01), von Vajna
patent: 5798014 (1998-08-01), Weber
patent: 5819388 (1998-10-01), Salm
patent: 5831218 (1998-11-01), Hu et al.
patent: 5834084 (1998-11-01), Maggio
patent: 5923995 (1999-07-01), Kao et al.
patent: 5966052 (1999-10-01), Sakai
patent: 6007470 (1999-12-01), Komarek et al.
patent: 6007886 (1999-12-01), Takigami
patent: 6054338 (2000-04-01), Lee et al.
patent: 6057175 (2000-05-01), Milla et al.
patent: 6136681 (2000-10-01), Razon et al.
patent: 6239380 (2001-05-01), Drussel et al.
patent: 6271102 (2001-08-01), Brouillette et al.
patent: 6326240 (2001-12-01), Liaw
patent: 6359235 (2002-03-01), Hayashi
patent: 6383835 (2002-05-01), Hata et al.
patent: 6407333 (2002-06-01), Schroen
patent: 6438829 (2002-08-01), Haake
patent: 6475878 (2002-11-01), Slepcevic
patent: 6534726 (2003-03-01), Okada et al.
patent: 6586677 (2003-07-01), Glenn
patent: 6624921 (2003-09-01), Glenn et al.
patent: 6687970 (2004-02-01), Waechter et al.
patent: 6694852 (2004-02-01), Ours et al.
patent: 6710246 (2004-03-01), Mostafazadeh et al.
patent: 6722030 (2004-04-01), Stelzl et al.
patent: 6724083 (2004-04-01), Ohuchi et al.
patent: 6751085 (2004-06-01), Huntington
patent: 196 19 921 (1996-12-01), None
patent: 0 828 346 (1998-03-01), None
patent: 2-14547 (1990-01-01), None
patent: 09 223 678 (1997-08-01), None
patent: 10 154 668 (1998-06-01), None
Martin A. Schmidt:: “Wafer-to-Wafer Bonding for Microstructure Formation”,Proceedings of the IEEE, vol. 86, No. 8, Aug. 1998, pp. 1575-1585.
Sven Michaelis et al.: “Acceleration Threshold Switches from an Additive Electroplating MEMS Process”,Eurosensors XIII, The 13thEuropean Conference on Solid-State Transducers, Sep. 12-15, 1999, The Hague, The Netherlands, Section 24B1, Inertial sensors, pp. 785-788.
M. Wycisk et aL.: “Low Cost Post-CMOS Integration of Electrolated Microstructures For Inertial Sensing”,Siemens Semiconductors, Munich, Germany.
Michael Wycisk et al.: “New sensor on-chip technology for micromechanical acceleration-threshold switches”,Wireless Product Sensors, Munich, Germany.
Sven Michaelis et al.: “Additive Electroplating Technology as a Post-CMOS Process for the Production of MEMS Accelaration-Threshold Switches for Transportation Applications”, IMSAS, University of Bremen, Bremen, Germany.
Aigner Robert
Brauer Michael
Michaelis Sven
Plötz Florian
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