Method of producing micromachined differential pressure transduc

Details Method of producing micromachined differential pressure transduc Method of producing micromachined differential pressure transduc

1990-12-07

1993-03-02

Echols, P. W.

Metal working

Method of mechanical manufacture

Utilizing transitory attached element or associated separate...

296211, 427123, 430324, 430319, 430967, B23P 1700

Patent

active

051897776

ABSTRACT:
Microminiature pressure transducers are formed on semiconductor substrates such as silicon and include a membrane which spans a cavity over the substrate, with the membrane being mounted to and sealed to the substrate at the peripheral edges of the membrane. The bottom of the cavity forms an overpressure stop to prevent over deflections of the membrane toward the substrate. An overpressure stop formed as a bridge of a material such as nickel extends above the membrane and is spaced therefrom to allow the membrane to deflect freely under normal pressure situations but prevent over deflections. The thickness of the polysilicon membrane and the spacing between the membrane and the overpressure stops is preferably in the range of 10 micrometers or less, and typically in the range of one micrometer. The overpressure stop bridge is formed utilizing deep X-ray lithography to form a well-defined bridge structure. The gap between the membrane and the bottom surface of the bridge is established with a sacrificial layer, such as a polyimide film, which dissolves in a solvent. The transducer is formed utilizing processing techniques which do not affect the performance of the membrane as a pressure sensor and which allow the substrate to have further micromechanical or microelectronic devices formed thereon.

REFERENCES:
patent: 3449221 (1969-06-01), Thomas
patent: 3535137 (1970-10-01), Haller et al.
patent: 3886584 (1975-05-01), Cook, Jr. et al.
patent: 3984582 (1976-10-01), Feder et al.
patent: 4018938 (1977-04-01), Feder et al.
patent: 4035522 (1977-06-01), Hatzakis
patent: 4059480 (1977-11-01), Ruh et al.
patent: 4107351 (1978-08-01), James et al.
patent: 4203128 (1980-05-01), Guckel et al.
patent: 4351653 (1982-09-01), Becker et al.
patent: 4422905 (1983-12-01), Becker et al.
patent: 4493753 (1985-01-01), Becker et al.
patent: 4541977 (1985-09-01), Becker et al.
patent: 4563250 (1986-01-01), Becker et al.
patent: 4563251 (1986-01-01), Becker et al.
patent: 4661212 (1987-04-01), Ehrfeld et al.
patent: 4693791 (1987-09-01), Becker et al.
patent: 4694548 (1987-09-01), Ehrfeld et al.
patent: 4698285 (1987-10-01), Ehrfeld et al.
patent: 4703559 (1987-11-01), Ehrfeld et al.
patent: 4705605 (1987-11-01), Becker et al.
patent: 4738010 (1988-04-01), Ehrfeld et al.
patent: 4744863 (1988-05-01), Guckel et al.
patent: 4780382 (1988-10-01), Stengl et al.
patent: 4784935 (1988-11-01), Ehrfeld et al.
patent: 4797211 (1988-01-01), Ehrfeld et al.
patent: 4853669 (1989-08-01), Guckel et al.
patent: 4872888 (1989-10-01), Ehrfeld et al.
patent: 4897360 (1990-01-01), Guckel et al.
patent: 5013693 (1991-05-01), Guckel et al.
H. Guckel, et al. "Fine Grained Polysilicon and Its Application to Pressure Transducers", Proceedings of Fourth International Conference on Sensors and Actuators, Tokyo Japan, Jun. 1987, pp. 277-282.
H. Guckel, et al., "Mechanical Properties of Fine Grained Polysilicon: The Repeatability Issue", IEEE Technical Digest for Solid State Sensors & Actuators, Hilton Head, S.C., Jun., 1988, pp. 96-99.
H. Guckel, et al., "Fine Grained Polysilicon Films With Built-In Tensile Strain", IEEE Trans. on Elect. Devices vol. 35, No. 6, Jun. 1988, pp. 800-801.
H. Guckel, et al., "Construction and Perfomance Characteristics of Polysilicon Resonating Beam Force Transducers", Pro. of Third Toyota Conf. Nissin Aichi Japan, 1989 pp. 23-1, 23-10.
R. Howe, et al, "Silicon Micromechanics: Sensors and Actuators on a Chip", IEEE Spectrum, Jul., 1990, pp. 29-31, 34.35.
Brochure (in German) "Die LIGA-Technik", by MicroParts, Gesellschaft, 1990.
E. W. Becker, et al., "Fabrication on Microstructures with High Aspect Ratios and Great Structural Heights by Synchrotron Radiation Lithography Galvanoforming and Plastic Moulding (LIGA Process)", Microelectronic Engineering, vol. 4, No. 1, May 1986, pp. 35-36.
W. Ehrfeld, et al., "Fabrication of Microstructures Using the LIGA Process", Proc. IEEE Micro Robots and Teleoperators Workshop, Nov. 9-11, 1987, pp. 1-11.
P. Hagmann, et al., "Fabrication of Microstructures of Extreme Structural Heights by Reaction Injection Moulding", Intl. Polymer Processing IV 1989 pp. 188-195.
W. Ehrfeld, et al., "Microfabrication of Sensors and Actuators For Microrobots", Proc. IEEE International Workshop on Intelligent Robots and Systems, Tokyo, Japan, Oct. 31-Nov. 2, 1988, pp. 3-7.
W. Ehrfeld, "Three Dimensional Microfabrication Using Synchrotron Radiation", International Symposium on X-Ray Synchrotron Radiation and Advanced Science and Technolgy, 15-16 Feb. 1990, pp. 121-141.
W. Ehrfeld, et al, "LIGA Process: Sensor Construction Techniques Via X-Ray Lithography", Technical Digest, IEEE Solid State Sensor and Actuator Workshop, 1988, pp.1-4.
H. Guckel, et al., "Deep X-Ray and UV Lithographies for Micromechanics", Technical Digest, IEEE Solid State Sensor and Actuator Workshop, Hilton Head, S.C., Jun. 4-7, 1990, pp. 118-122.
PiRL: Polymide Release Layer, Brochure from Brewer Science, Inc.

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