Method of producing metallic carrier system for a multi-electrod

Details Method of producing metallic carrier system for a multi-electrod Method of producing metallic carrier system for a multi-electrod

1976-08-30

1977-09-06

Powell, William A.

Metal working

Method of mechanical manufacture

Assembling or joining

29591, 29627, 156151, 156634, 156661, 204 15, 357 70, B01J 1700, C23F 102

Patent

active

040458636

ABSTRACT:
Method of producing a metallic carrier system mounting, making conductive contact with a semi-conductor member through relatively thin tongue-like inner feed lines made from a different metal than the metal of the carrier. The inner feed lines are made from a metal that can readily be connected with the electrodes of the semi-conductor, such as nickel. The thin feed lines extend from the outer support and connection legs and are made from a different metal that can readily be soldered, such as brass and have conductive contact with said legs. The inner feed lines and carrier are made by an etching process. The inner feed lines supporting the semi-conductor are resilient, and by their resiliency balance thermal expansion between the semi-conductor substrate and the coarse structure of the connection legs of the system carrier.

REFERENCES:
patent: 3139392 (1964-06-01), Mears
patent: 3324530 (1967-06-01), Sherwood et al.
patent: 3680206 (1972-08-01), Roberts
patent: 3773628 (1973-11-01), Misawa et al.

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