Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-07-10
2007-07-10
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S127000, C257SE21504
Reexamination Certificate
active
10528007
ABSTRACT:
Method of producing light-conducting LED bodies of a free-flowing material by introduction into a mold. Here, the volumetric flow of a free-flowing material, at a distance of the electrode plane from the charging point that is greater than 35% of the distance between the charging point and the mold side of the mold situated opposite the charging point—above the charging point and below the chip plane on the mold side of the charging point, is choked by at least one cross-sectional constriction, while—at a distance that is smaller than or equal to 35% of this distance—choking takes place on the mold side situated opposite the charging point. The present invention develops a method of producing light-conducting LED bodies in which, at customary output capacities of the molding operation, the LED electronics are not damaged.
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G.L.I. Global Light Industries GmbH
Picardat Kevin M.
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