Food or edible material: processes – compositions – and products – Surface coated – fluid encapsulated – laminated solid... – Isolated whole seed – bean or nut – or material derived therefrom
Patent
1990-06-07
1991-11-05
Czala, Donald E.
Food or edible material: processes, compositions, and products
Surface coated, fluid encapsulated, laminated solid...
Isolated whole seed, bean or nut, or material derived therefrom
426275, 426497, 426502, 426503, 426549, 426560, A21D 1300, A23G 300
Patent
active
050630687
ABSTRACT:
Laminated bread wafers are produced by fusing at least part of the opposing outer friable crust of two (or more) sheets of bread. Each sheet is composed of outer friable crusts surrounding a center which is soft and porous relative to the crusts. Specifically, one outer crust or a first sheet and one outer crust of a second sheet are moistened by applying droplets of water (e.g. from sprayed water or steam) sufficient to render them fusable. Thereafter, the moistened outer crusts are pressed together to fuse them. Alternatively, an aqueous paste is applied between at least part of an outer crust of the first sheet and at least part of an outer crust of the second sheet, and the sheets are pressed together to fuse them. The resulting laminated bread product comprises multiple layers with a sealed edge, the layers being arranged in the following order: a top friable crust, a porous softer upper core layer, a central fusion layer, a porous softer lower core layer, and a bottom friable crust.
REFERENCES:
patent: 1975326 (1934-10-01), Loose et al.
patent: 2888887 (1959-06-01), Wolf
patent: 3670665 (1972-06-01), Levi
patent: 3867559 (1975-02-01), Haas
patent: 4352831 (1982-10-01), Cavanagh et al.
patent: 4469476 (1984-09-01), Cavanagh et al.
patent: 4518617 (1985-05-01), Haas Sr., et al.
patent: 4621997 (1986-11-01), Cavanagh, Jr. et al.
Aberle Jean L.
Cavanagh Company
Czala Donald E.
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