Etching a substrate: processes – Forming or treating thermal ink jet article
Patent
1997-02-06
1999-07-13
Powell, William
Etching a substrate: processes
Forming or treating thermal ink jet article
216 2, 216 41, B44C 122, H01L 2100
Patent
active
059222182
ABSTRACT:
In an ink jet head having: a nozzle plate in which a plurality of nozzle openings are formed; a flow path substrate comprising a reservoir to which ink is externally supplied, and a plurality of pressure chambers which are connected to the reservoir via an ink supply port and which respectively communicate with the nozzle openings; an elastic film which pressurizes ink in the pressure chambers; and driving means located at a position opposing the respective pressure chambers for causing the elastic film to conduct flexural deformation, the pressure chambers are arranged in a single-crystal silicon substrate of a (110) lattice plane and along a <112> lattice orientation.
REFERENCES:
patent: 5637126 (1997-06-01), Ema et al.
Miyata Yoshinao
Nishiwaki Tsutomu
Powell William
Seiko Epson Corporation
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