Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal
Patent
1975-12-30
1976-12-21
Ozaki, G.
Metal treatment
Process of modifying or maintaining internal physical...
Chemical-heat removing or burning of metal
148172, 148 335, 29580, 357 17, 156 17, 252 623GA, H01L 21208
Patent
active
039986721
ABSTRACT:
A recess is formed in one of the principal surfaces of an N-type substrate of GaAs. Through the liquid phase growth technique, a silicon-doped N-type GaAs layer is formed on the one of the principal surfaces and on the surface of the recess and a silicon-doped P-type GaAs layer is continuously formed on the N-type GaAs layer. The liquid-phase-grown GaAs layers are so cut that the PN junction between the layers may be exposed on a plane.
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Kurihara Yasutoshi
Miyoshi Tadahiko
Ura Mitsuru
Hitachi , Ltd.
Ozaki G.
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