Method of producing hybrid multi-layered circuit substrate

Details Method of producing hybrid multi-layered circuit substrate Method of producing hybrid multi-layered circuit substrate

1988-06-23

1989-10-10

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156253, 156257, 156267, 156268, 29830, 361386, 361391, 428901, B32B 3118

Patent

active

048729345

ABSTRACT:
A method for producing a hybrid multi-layered circuit substrate which utilizes prefabricated flexible printed circuit(s) which are rigidized in areas which define high density hybrid circuits. The hybrid circuit regions are formed by disposing copper-lined sheets on both surfaces of the flexible circuit, adhesively bonding the copper-lined sheets to the flexible circuit, forming through-hole conductors and etching a circuit pattern in the copper layer of the lined sheets. The copper-lined sheets are initially general coextensive in size and shape with the flexible circuit and are subsequently severed so that the copper-lined sheets remain only in the hybridized portions of the product. Separation is achieved by mechanically punching along predetermined boundaries and is facilitated by providing either any elongated narrow through-hole at the boundary of the hybrid circuit from which the flexible circuit will extend the end product or by forming a groove in the copper-lined sheets at such boundary.

REFERENCES:
patent: 4149219 (1979-04-01), Kraft
patent: 4338149 (1982-07-01), Quaschner
patent: 4495546 (1985-01-01), Nakamura et al.
patent: 4715928 (1987-12-01), Hamby

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