Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2000-04-07
2004-01-13
Vo, Peter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S412000, C029S426500, C029S847000, C029S884000, C029S885000, C072S379200, C174S050510, C174S050510, C174S261000, C174S262000, C361S736000, C361S744000, C361S772000, C361S773000, C361S790000
Reexamination Certificate
active
06675471
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a method of producing high-frequency modules for use in, for example, portable telephones. Conventional voltage-controlled oscillators (referred to as VCOs, an example of high-frequency modules) are manufactured by a method comprising a first step of mounting electronic components onto a group of sub substrates
2
configured in a uniform pattern and joined to each other on a master substrate
1
as shown in
FIG. 17
, a second step of separating the sub substrates
2
on the main substrate
1
from each other as shown in
FIG. 18
as following the first step, a third step of examining each of the separated sub substrates
2
for its correct function via connection with a power supply and trimming with a laser beam using the inductance of a resonant circuit fabricated in the pattern to determine the frequency as following the second step, a fourth step of covering the sub substrate
2
with a shielding case
3
as shown in
FIG. 19
as following the third step, and a fifth step of carrying out a final inspection as following the fourth step.
FIG. 20
is an enlarged view of a primary part of the master substrate
1
showing rows of the sub substrates
2
of a rectangular shape joined to each other on the master substrate
1
, both ends of the rows of the sub substrates
2
being linked to connector regions
4
at both edges of the master substrate
1
. Signal terminals
5
,
6
,
7
, and
8
are provided on both side edges
10
of each the sub substrates
2
. Grounding terminals
9
are provided on the side edges
10
while grounding terminals
11
are provided on both longitudinal end edges
12
of the sub substrate
2
. The signal terminal
5
may be connected to a first circuit
13
in the pattern which is then connected by a second circuit
14
to the signal terminal
6
at the other side. The signal terminal
7
may be connected by a third circuit
15
to the signal terminal
8
at the other side. Dummy regions
16
are provided as will be punched off by a punch for defining the side edges
10
of the sub substrate
2
. The longitudinal end edges
12
are grooved in V shape for ease of separating the sub substrates
2
from each other.
SUMMARY OF THE INVENTION
Such a conventional method, as described above, of fabricating high-frequency modules, namely VCOs, has a drawback in that the sub substrates
2
are separated from the master substrate
1
at the second step and then aligned again for the frequency adjustment at the third step, hence lowering the efficiency of the production process. The present invention has been developed for eliminating the foregoing drawback and its object is to provide a method of producing high-frequency modules at a higher rate of the production efficiency.
For achievement of the object of the present invention, the method of producing high-frequency modules comprises: a first step of fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, each the sub substrates formed of substantially a rectangular shape and having an identical pattern of circuit developed thereon, providing, on both side edges of the sub substrate, a set of signal terminals connected to a first circuit so that the signal terminals at each side edge are formed integral with other signal terminals provided on the corresponding side edge of the neighbor sub substrate and connected to a second circuit, and mounting electronic components on the sub substrate; a second step of, after the first step, electrically isolating the signal terminals at each side edge of the sub substrates from the other signal terminals at the corresponding side edge of the neighbor sub substrate while the connector regions of the master substrate remain linked to the sub substrates; a third step of, after the second step, conducting a first inspection with pins of an inspection tooling engaged in direct contact with the signal terminals of the sub substrates; and a fourth step of, after the third step, separating the sub substrates from the master substrate by cutting along the longitudinal end edges of each the sub substrates. Accordingly, the productivity for the high-frequency modules will be improved.
As a first feature of the present invention, a method of producing high-frequency models comprises: a first step of fabricating, on a master substrate, a plurality of sub substrates linked to connector regions at both ends of the master substrate, each the sub substrates formed of substantially a rectangular shape and having an identical pattern of circuit developed thereon, providing, on both side edges of the sub substrate, a set of signal terminals connected to a first circuit so that the signal terminals at each side edge are formed integral with other signal terminals provided on the corresponding side edge of the neighbor sub substrate and connected to a second circuit, and mounting electronic components on the sub substrate; a second step of, after the first step, electrically isolating the signal terminals at each side edge of the sub substrates from the other signal terminals at the corresponding side edge of the neighbor sub substrate while the connector regions of the master substrate remain linked to the sub substrates; a third step of, after the second step, conducting a first inspection with pins of an inspection tooling engaged in direct contact with the signal terminals of the sub substrates; and a fourth step of, after the third step, separating the sub substrates from the master substrate by cutting along the longitudinal end edges of each the sub substrates. As the second step is provided for electrically isolating the signal terminals on the side edges of any two adjacent sub substrates from each other, the method can be carried out up to the third step for the inspection using the form of a worksheet. Since the sub substrates are separated from each other after the third step, the productivity will significantly be increased without conducting such a troublesome step as in a conventional method of separating sub substrates and then aligning them again for the inspection.
Also, because the separation of the sub substrates is performed directly at the signal terminals on their side edges, such dummy portions to be punched out as in a conventional method can be eliminated and the loss of substrate materials can be minimized hence contributing to the lower cost of the production.
As a second feature of the present invention, the method of producing high-frequency modules according to the first feature is modified in that the electrically isolating the signal terminals at the second step is implemented by providing slits. This permits any two adjacent signal terminals to be electrically isolated from each other at higher certainty. Also, the electrical isolation is physically implemented thus eliminating such a troublesome process as a cutting of the side edges of the sub substrates by means of the fingers of a worker.
As a third feature of the present invention, the method of producing high-frequency modules according to the first feature is modified in that the electrical isolation of the signal terminals at the second step is implemented by providing grooves. The grooves permit the sub substrates to be isolated from each other only electrically but not physically, whereby the sub substrates, when urged by the pins at the third step, can hardly be deflected by the urging force hence ensuring the reliability of the first inspection of the third step.
As a fourth feature of the present invention, the method of producing high-frequency modules according to the first feature is modified in that, when the pins are moving to engage in direct contact at the third step, their grounding pines are allowed to touch at the earliest and when disengaging, to depart at the latest. This sequence of energization can ensure the inspection at a higher electrical stability.
As a fifth feature of the present invention, the method of producing high-frequency modules ac
Kimura Jun-ichi
Tamura Toshiaki
Tsuyama Kazuhiko
Yajima Takahiro
Kim Paul
Vo Peter
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Method of producing high-frequency modules does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of producing high-frequency modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing high-frequency modules will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3266378