Method of producing harmonics generating device

Details Method of producing harmonics generating device Method of producing harmonics generating device

2011-01-25

2011-01-25

Gray, Linda L (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S268000, C156S322000, C156S330000, C382S132000, C372S022000

Reexamination Certificate

active

07875146

ABSTRACT:
It is provided a chip having a supporting substrate, a wavelength conversion layer, a base adhesive layer made of an organic resin, an upper-side substrate provided on an upper surface side of the wavelength conversion layer, and an upper-side adhesive layer made of an organic resin for adhering the wavelength conversion layer to the upper-side substrate. The wavelength conversion layer has an optical waveguide with a periodic domain inversion structure provided therein. The chip is heat treated. Anti-reflection films are formed on an incident side end face and projection side end face of the optical waveguide, respectively.

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U.S. Appl. No. 12/855,770, filed Aug. 13, 2010, Takashi Yoshino.

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