Method of producing epoxy resin film

Details Method of producing epoxy resin film Method of producing epoxy resin film

1993-02-25

1994-04-19

Owens, Terry J.

Coating processes

With post-treatment of coating or coating material

Heating or drying

264216, 26433111, 26433112, B05D 118

Patent

active

053043995

ABSTRACT:
An epoxy resin film which is so strong as to have a tensile strength of not less than 10 MPa and an elongation of not less than 5% is formed by using a substantially linear high molecular weight epoxy resin which is synthesized by polymerizing a difunctional epoxy resin having two epoxy groups per molecule and a dihydric phenol in an aprotic polar solvent, in the presence of a solvent, at a reaction temperature ranging from 80.degree. to 130.degree. C., the difunctional epoxy resin and the dihydric phenol being used in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1 and a proportion of the total of them of at most 50% by weight based on the total of them and the aprotic polar solvent.

REFERENCES:
patent: 3306872 (1967-02-01), Maycock et al.
patent: 4612156 (1986-09-01), Heinemeyer et al.
patent: 4778863 (1988-10-01), Wang et al.
patent: 4900801 (1990-02-01), Takata et al.
patent: 4921927 (1990-01-01), Hefner et al.
Kirk Othmer Encyclopedia of Chemical Technology, vol. 20, pp. 265-266, 1979.

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