Method of producing electronic parts with an electrode pattern b

Metal working – Electric condenser making – Solid dielectric type

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Details

296021, 29825, 29854, H01G 406

Patent

active

058026886

ABSTRACT:
An electronic part is formed with two dielectric substrates joined together in a face-to-face relationship. Each substrate has an electrode pattern formed on one surface and a grounding surface on the opposite surface. The surfaces with the electrode patterns formed thereon are joined together such that the patterns match each other and are connected to each other. Corners of one of the substrates may be cut so as to expose portions of the electrode pattern on the other substrate. Indentations may be formed on corners and edges of the joined substrates and terminal electrodes and grounding electrodes may be formed in the indentations.

REFERENCES:
patent: 5488765 (1996-02-01), Kubota et al.

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