Coating processes – Measuring – testing – or indicating – Thickness or uniformity of thickness determined
Patent
1986-03-11
1987-04-07
Bueker, Richard
Coating processes
Measuring, testing, or indicating
Thickness or uniformity of thickness determined
427 541, 427 82, 427 96, 427337, 4273855, 430319, B05D 512
Patent
active
046560505
ABSTRACT:
A method of producing electronic components is disclosed wherein an insulator is in situ cured. The insulator is comprised of a polymerizable oligomer end capped with vinyl and/or acetylenic end groups which both imidize and cross-link upon cure to provide a three-dimensional dielectric network.
REFERENCES:
patent: 3486934 (1969-12-01), Bond et al.
patent: 3515585 (1970-06-01), Chamberlin et al.
patent: 3700497 (1972-10-01), Epifano et al.
patent: 3766438 (1973-10-01), Castrucci et al.
patent: 3846166 (1974-11-01), Saiki et al.
patent: 3961355 (1976-06-01), Abbas et al.
patent: 3985597 (1976-10-01), Zielinski
patent: 4030948 (1977-06-01), Berger
patent: 4104086 (1978-08-01), Bondur et al.
patent: 4139442 (1979-02-01), Bondur et al.
patent: 4160991 (1979-07-01), Anantha et al.
patent: 4258146 (1981-03-01), Balanson et al.
patent: 4333794 (1982-06-01), Beyer et al.
patent: 4347306 (1982-08-01), Takeda et al.
patent: 4353778 (1982-10-01), Fineman et al.
patent: 4367119 (1983-01-01), Logan et al.
Kaiser et al, "A Fabrication Technique for Multilayer Ceramic Modules", Solid State Technology, May 1972, pp. 35-40.
Mukai et al, "Planar Multilevel Interconnection Technology Employing a Polyimide", IEE Journal of Solid-State Circuits, vol. 13, No. 4, Aug. 1978, pp. 462-467.
Araps Constance J.
Kandetzke Steven M.
Takacs Mark A.
Bueker Richard
International Business Machines - Corporation
Moore Shirley Church
LandOfFree
Method of producing electronic components utilizing cured vinyl does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of producing electronic components utilizing cured vinyl , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing electronic components utilizing cured vinyl will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1086151