Method of producing electronic components utilizing cured vinyl

Coating processes – Measuring – testing – or indicating – Thickness or uniformity of thickness determined

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 541, 427 82, 427 96, 427337, 4273855, 430319, B05D 512

Patent

active

046560505

ABSTRACT:
A method of producing electronic components is disclosed wherein an insulator is in situ cured. The insulator is comprised of a polymerizable oligomer end capped with vinyl and/or acetylenic end groups which both imidize and cross-link upon cure to provide a three-dimensional dielectric network.

REFERENCES:
patent: 3486934 (1969-12-01), Bond et al.
patent: 3515585 (1970-06-01), Chamberlin et al.
patent: 3700497 (1972-10-01), Epifano et al.
patent: 3766438 (1973-10-01), Castrucci et al.
patent: 3846166 (1974-11-01), Saiki et al.
patent: 3961355 (1976-06-01), Abbas et al.
patent: 3985597 (1976-10-01), Zielinski
patent: 4030948 (1977-06-01), Berger
patent: 4104086 (1978-08-01), Bondur et al.
patent: 4139442 (1979-02-01), Bondur et al.
patent: 4160991 (1979-07-01), Anantha et al.
patent: 4258146 (1981-03-01), Balanson et al.
patent: 4333794 (1982-06-01), Beyer et al.
patent: 4347306 (1982-08-01), Takeda et al.
patent: 4353778 (1982-10-01), Fineman et al.
patent: 4367119 (1983-01-01), Logan et al.
Kaiser et al, "A Fabrication Technique for Multilayer Ceramic Modules", Solid State Technology, May 1972, pp. 35-40.
Mukai et al, "Planar Multilevel Interconnection Technology Employing a Polyimide", IEE Journal of Solid-State Circuits, vol. 13, No. 4, Aug. 1978, pp. 462-467.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of producing electronic components utilizing cured vinyl does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing electronic components utilizing cured vinyl , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing electronic components utilizing cured vinyl will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1086151

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.