Method of producing electronic components

Details Method of producing electronic components Method of producing electronic components

1990-03-05

1991-07-02

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29412, 294263, 29759, 174 524, 361412, 361414, H05K 330

Patent

active

050275054

ABSTRACT:
The present invention provides a method of producing electronic components such as LED displays and hybrid IC's from a broad supply frame. The frame comprises a parallel pair of elongate side bands, and a plurality of unit circuit boards integrally incorporated in the frame by means of connecting webs and arranged between the pair of side bands at a predetermined interval therealong. Various process steps such as chip bonding and wire bonding are performed with respect to the individual circuit boards while they are still in the frame. In a final step, each unit circuit board or electronic component is separated from the frame. The frame may be provided with an identification pattern to identify the type of unit circuit boards incorporated in the frame.

REFERENCES:
patent: 4202092 (1980-05-01), Shibasaki et al.
patent: 4316320 (1982-02-01), Nogawa et al.
patent: 4393083 (1982-08-01), Takemura et al.
patent: 4850103 (1989-07-01), Takemoto et al.
patent: 4956605 (1990-09-01), Bickford et al.

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