Method of producing electronic component

Details Method of producing electronic component Method of producing electronic component

1998-08-11

2000-11-07

Young, Lee

Metal working

Piezoelectric device making

29877, 156292, 1563031, 156 8912, 438119, H04R 1700

Patent

active

061418455

ABSTRACT:
An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element. Input and output lead terminals are connected to the electrodes on the substrate, while a grounding lead terminal is connected to the cap.

REFERENCES:
patent: 3655482 (1972-04-01), Schildkraut et al.
patent: 4703656 (1987-11-01), Bhardwaj
patent: 5231326 (1993-07-01), Echols
patent: 5405476 (1995-04-01), Knecht
patent: 5856935 (1999-02-01), Ozimek et al.

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