Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Sheet – web – wire – or filament
Patent
1992-10-22
1994-07-05
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electroforming or composition therefor
Sheet, web, wire, or filament
204211, 205 84, 205 96, C25D 104
Patent
active
053264550
ABSTRACT:
In a method of producing an electrolytic copper foil by passing an electrolyte between a rotating cathode drum and anode located opposite to the cathode drum, the thickness of the resulting copper foil is made uniform throughout. The anode has a structure including a main portion and an end portion, the end portion being divided widthwise into n foil thickness-uniformizing sub-anodes. Electricity is supplied to the main anode and the sub-anodes at a preset current density D (A/dm.sup.2) to attain a target foil thickness T (g/m.sup.2). Variations of thickness in the direction of the width of the resulting copper foil are measured as the thicknesses Tm (g/m.sup.2) where m=1-n in the direction of the width of the copper foil corresponding to the n sub-anodes, and the quantities of electricity being supplied to the n sub-anodes are individually controlled at current densities Dm (A/dm.sup.2) where m=1-n so that Tm values are made equal to the target foil thickness T (g/m.sup.2). Alternatively, a pattern of thickness deviations of a copper foil produced per revolution of the cathode drum is divided into m sections where m=1-n widthwise and k sections lengthwise, the foil thicknesses Tm-k (g/m.sup..sup.2) where m=1-n of the m .times.k sections corresponding to the angle of rotation from a reference point of the cathode drum as determined by an encoder are measured, and the quantities of electricity supplied to the n sub-anodes at current densities Dm-k (A/dm.sup.2) where m=1-n are controlled individually correspondingly to the angle of rotation from the reference point of the cathode drum so that Tm-k becomes equal to the target foil thickness T.
REFERENCES:
patent: 3799847 (1974-03-01), Vladimirovna et al.
patent: 4053370 (1977-10-01), Yamashita et al.
patent: 4490218 (1984-12-01), Kadija et al.
F. A. Lowenheim, Electroplating, Ch. 20 "Electroforming", McGraw-Hill Book Co., New York, 1978, pp. 426-441.
ANSI/IPC-CF.150E "Copper Foil of Printing Wiring Applications" The Inst. for Interconnecting and Packaging Electronic Circuits (May 1981).
Fujishima Katsuhiko
Kubo Toyoshige
Yamamoto Narito
Leader William T.
Niebling John
Nikko Gould Foil Co., Ltd.
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