Method of producing directly heatable hollow semiconductor bodie

Details Method of producing directly heatable hollow semiconductor bodie Method of producing directly heatable hollow semiconductor bodie

1974-05-30

1976-08-17

Tupman, W.

Metal working

Method of mechanical manufacture

Electrical device making

29576R, 29589, 148188, 118 491, H05B 300

Patent

active

039745619

ABSTRACT:
Hollow semiconductor bodies are formed from a gaseous phase by deposition on a heated mandrel and end zones of a so-produced body are doped so as to be conductive at room temperature.

REFERENCES:
patent: 3660156 (1972-05-01), Schmidt
patent: 3751539 (1973-08-01), Reuschel
patent: 3761782 (1973-09-01), Youmans
patent: 3834939 (1974-09-01), Beyer
patent: 3865647 (1975-02-01), Reuschel

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