Method of producing copper-clad laminated board

Details Method of producing copper-clad laminated board Method of producing copper-clad laminated board

1992-05-01

1994-02-15

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29829, 100211, 100295, 156153, 1563074, 174259, B65C 925

Patent

active

052863301

ABSTRACT:
A method for preparing a copper-clad laminated board for a printed circuit board which comprises: (a) preparing a prepreg by permeating a thermosetting resin into a fabric and then drying the resulting material to a half-hardened state, (b) laminating a both-side roughened copper foil on both sides or one side of the prepreg or a plurality of prepregs bonded together, (c) placing the resulting laminate from step (b) between both press plates of a press machine, (d) placing a polyamide film having a melting point equal to or higher than 170.degree. C. between the exposed side of the both-side roughened copper foil of the laminate and a press plate, (e) pressing the laminate with the press plates of the press machine at a temperature of 170.degree. C. or higher, a pressure of 10 kgf/cm.sup.2 or higher for a time of 60 minutes or longer, (f) separating the laminate from the press machine and (g) peeling the polyamide film from the laminate to obtain the copper-clad laminated board. The copper-clad laminated board can be used for a printed circuit board.

REFERENCES:
patent: 3677876 (1972-07-01), Oliver

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