Method of producing circuit component built-in module with...

Details Method of producing circuit component built-in module with... Method of producing circuit component built-in module with...

2006-11-28

2006-11-28

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S832000, C029S739000, C029S740000, C257S618000, C257S700000, C257S730000, C174S262000, C174S264000

Reexamination Certificate

active

07140104

ABSTRACT:
A circuit component built-in module can be produced by filling a conducting material in through holes of a sheet-like member, stacking the sheet-like member and a metal foil on a circuit component package, and applying heat and pressure to embed the circuit component in the sheet-like member, and patterning the metal foil. The circuit component package includes a mounting member with substrate and wiring pattern and a circuit component. The circuit component includes a component body and external electrode, with the component body being thinner at a portion on which the external electrode is provided. The external electrode is provided on a surface of the circuit component that is opposed to the mounting member, and the component body is in contact with the mounting member.

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