Method of producing circuit board

Details Method of producing circuit board Method of producing circuit board

2006-08-14

2008-12-02

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S846000, C427S096100, C427S372200, C427S383100, C430S311000

Reexamination Certificate

active

07458150

ABSTRACT:
A method of producing a circuit board includes a step of providing a conductive paste including metal nano-particles at an insulating substrate, and a step of sintering the conductive paste so as to form a circuit conductor. In the sintering step, the conductive paste is sintered in a low-oxygen condition including alcohol such that the metal nano-particles are sintered.

REFERENCES:
patent: 6099745 (2000-08-01), McKenney et al.
patent: 6228467 (2001-05-01), Taniguchi et al.
patent: 6991470 (2006-01-01), Muench
patent: 2002/0106577 (2002-08-01), Kubota
patent: 2006/0057502 (2006-03-01), Okada et al.
patent: 2006/0210705 (2006-09-01), Itoh et al.
patent: 2002-299833 (2002-10-01), None

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