Method of producing base plate circuit board, base plate for...

Details Method of producing base plate circuit board, base plate for... Method of producing base plate circuit board, base plate for...

2008-01-29

2008-01-29

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S627000, C257S703000, C257S706000, C257S713000, C257S717000, C174S252000, C361S706000, C361S709000, C361S711000, C361S719000

Reexamination Certificate

active

07323255

ABSTRACT:
First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member through hot pressing. As a result, part of the Al foil member enters casting blowholes on the surface of the plate member to fill the casting blowholes. In addition, an Al—Mg-based alloy layer is formed on the surface of the plate member. Thus, a base plate having a nearly flat surface is produced.

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