Plastic and nonmetallic article shaping or treating: processes – Outside of mold sintering or vitrifying of shaped inorganic... – Of electrical article or electrical component
Patent
1998-09-21
2000-04-04
Derrington, James
Plastic and nonmetallic article shaping or treating: processes
Outside of mold sintering or vitrifying of shaped inorganic...
Of electrical article or electrical component
264615, 264620, 156 8912, 156 8914, 156 8916, 156 8917, C04B 3564, C04B 3700
Patent
active
060457473
ABSTRACT:
A method is provided of producing an LC-circuit in form of a single component, in which the inductor and capacitor elements are arranged atop one another, and where the inductor elements are formed by ferromagnetic zones made of layers (6,8) of ferrite of a high permeability, and between which electrode layers (7) are provided, and where the capacitor elements are formed by dielectric zones made of layers (9) of dielectric with electrode layers (4,5) on both sides, said inductor and capacitor elements being produced by way of tape- or thick-film technology. According to the invention, the capacitor elements are initially provided and being subjected to a sintering at a relatively high temperature, whereafter the inductor elements (6,7,8) are applied and a sintering is performed at a considerably low temperature. In this manner undesired reactions are avoided between the two zones.
REFERENCES:
patent: 4322698 (1982-03-01), Takahashi et al.
patent: 4746557 (1988-05-01), Sakamoto et al.
patent: 4990202 (1991-02-01), Murata et al.
patent: 5006182 (1991-04-01), Gantzhorn et al.
patent: 5197170 (1993-03-01), Senda et al.
patent: 5337026 (1994-08-01), Borchelt et al.
Patent Abstract of Japan, 7-106200.
Derrington James
The Whitaker Corporation
LandOfFree
Method of producing an LC-circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of producing an LC-circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing an LC-circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-361871