Method of producing an electronic device and electronic device

Details Method of producing an electronic device and electronic device Method of producing an electronic device and electronic device

2006-05-16

2006-05-16

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

Reexamination Certificate

active

07045712

ABSTRACT:
A method of producing an electronic device, with a stamped sheet-metal part loaded with electronic components being encapsulated in a thermoplastic, insulating material to provide protection against environmental influences, and also an electronic device comprising electronic components arranged on a stamped sheet-metal part and electrically connected to one another by the part, the stamped sheet-metal part and the electronic components being encapsulated in the thermoplastic, insulating material by the injection-molding process. Providing a device with which protection of the electronic components during encapsulation is ensured, the stamped sheet-metal part (2) has at least one region (3) similar to a protective shield, under which the electronic components are arranged, and the electronic components (4) are arranged downstream of the stamped sheet-metal part (2) in the direction of injection pressure (9) of the heated, thermoplastic, insulating material (5)

REFERENCES:
patent: 6665192 (2003-12-01), Wimberger Friedl et al.

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