Method of producing an electronic component, in particular a sur

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating electrolytic or nonelectrolytic coating after it is...

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205221, 205229, 427531, 427100, 29 2535, C25D 548, C23C 1414, B05D 512, H04R 1700

Patent

active

061361755

ABSTRACT:
The electronic component, specifically a SAW component with conductive structures disposed on a substrate is encapsulated for protection against environmental influences. The electrically conductive structures are sealed with a gas diffusion-constricting protective layer formed with an electrochemical or ion bombardment process.

REFERENCES:
patent: 4617487 (1986-10-01), Sone et al.
patent: 5815900 (1998-10-01), Ichikawa et al.
International Publication WO 95/30276 (Furbacher, B. et al.), dated Nov. 9, 1995.

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