Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2007-05-29
2007-05-29
Smith, Matthew (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S106000
Reexamination Certificate
active
10989650
ABSTRACT:
The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of this component is disposed on a substrate which includes or is entirely formed of plastic and is embedded in a plastic package molding compound. The plastic of the substrate has a glass transition temperature range which is lower than the glass transition temperature range of the plastic package molding compound.
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Blaszczak Stephan
Reiss Martin
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Smith Matthew
Stemer Werner H.
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