Method of producing an electronic component

Details Method of producing an electronic component Method of producing an electronic component

2006-05-02

2006-05-02

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S113000, C438S114000, C438S126000

Reexamination Certificate

active

07037761

ABSTRACT:
An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor chip also form the outer package sides of the electronic component. At least the corner regions and the edge regions of the rear side and the side border regions of the semiconductor chip have a plastic coating with a thickness in the micrometer range. Furthermore, the invention relates to a method of producing such an electronic component.

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patent: 5956605 (1999-09-01), Akram et al.
patent: 6255142 (2001-07-01), Babiarz et al.
patent: 6537482 (2003-03-01), Farnworth
patent: 197 28 992 (1999-01-01), None
patent: 10 316 955 (1998-12-01), None

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